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US 4,231,815 AGranted
Copper alloy brazing paste
AssigneeSMC Corporation
InventorJohn L. Snyder
Life of this patent
Estimating the term…
Abstract
Copper-manganese alloy brazing pastes can be substantially improved by the inclusion of a minor amount of silicon in the alloy. The brazing alloy can contain by weight between about 0.5% and 3% silicon to provide a brazing composition for brazing at temperatures between about 1650.degree. C. and 1850.degree. C.
Claims2
A copper-manganese brazing paste composition for brazing at temperatures between about 1650.degree. C. and 1850.degree. C., comprising:
- the alloy powder having an average particle size between 5 and 177 microns and dispersed in fugitive binder to provide a brazing paste containing by weight between 2% and 50% said fugitive binder, said alloy powder being an alloy consisting essentially of on a weight basis 60% to 75% copper, 24% to 37% manganese, and 0.5% to 3% silicon.
Dependencies are inferred from the claim text.