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US 4,230,814 AGranted
Heat curable compositions
AssigneeGeneral Electric Company
InventorJames V. Crivello
Life of this patent
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Abstract
Heat curable compositions are provided comprising cationically polymerizable organic materials such as epoxy resins, vinyl ethers or phenol formaldehyde resins and thermal curing agents, based on the use of dialkyl hydroxyarylsulfonium salts with an organic oxidant, such as an organic peroxide, azonitriles, etc. The heat curable compositions can be used as injection molding compounds or as a coating composition.
Claims8
Heat curable compositions comprising
- (A) a cationically polymerizable organic material
- (B) an effective amount of a thermal curing agent capable of effecting the cure of the cationically polymerizable organic material consisting essentially of an organic oxidant selected from the class consisting of organic peroxides, azo-bis-alkyl-nitriles, and quinones selected from the class consisting of p-chloranil and 3,3',-5,5'-tetramethyl-4,4'-diphenoquinone and a dialkyl hydroxyl arylsulfonium salt having an anion of the formula, MQ.sub.d, where M is a metal or metalloid, Q is a halogen radical and d is an integer equal to 4-6 inclusive.
Dependencies are inferred from the claim text.