Method for applying material to a substrate
AssigneeEmhart Industries, Inc.
InventorGerhart P. Klein
Life of this patent
Estimating the term…
Abstract
A means and method are provided for applying material to a substrate. In the means and the method, material is dispensed onto belt means and the belt means brought in contact with the substrate so as to transfer at least some of the material onto the substrate. The invention is particularly adaptable to the application of a band of silicone type material to a riser of an anode to be used in an electrolytic film-forming metal capacitor, the band of silicone type material helping to protect the anode riser during capacitor manufacture.
Claims14
A method of continuously applying a band of material completely around at least a selected portion of an anode riser for a capacitor comprising the steps of dispensing material on two continuous belt means, the belt means in an opposed, substantially parallel relationship with each other at at least one point and causing the material on the belt means to come in contact with the anode riser and thereby transfer at least some of the material onto the anode riser forming a band of material completely around the selected portion of the anode riser.
A method of continuously applying a band of material completely around at least a selected portion of an article comprising the steps of providing two continuous belt means having a major surface each, the major surfaces of the belt means in an opposed, substantially parallel relationship with each other at at least one point, applying a band of material onto the major surface of each belt means, bringing the two major surfaces carrying material into contact with the article at a point where the surfaces are in an opposed, substantially parallel relationship so as to transfer material to the article and thereby form a band of material completely around the article.
Dependencies are inferred from the claim text.