Gold conductor compositions
AssigneeE. I. Du Pont de Nemours and Company
InventorJohn J. Felten
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Abstract
Superior thick film gold conductor compositions useful in electronic microcircuits containing small amounts of silver. Improved properties prior to heat aging include surface characteristics, malleability and electrical conductivity. Improved properties of thermally aged aluminum wire bonds include adhesion, electrical continuity and electrical conductivity.
Claims9
A gold conductor composition suitable for application in thick film microcircuitry consisting essentially of 75-90% by weight of the composition of gold powder, binder selected from the group consisting of copper oxide, cadmium oxide, bismuth oxide and mixtures of two or more of copper oxide, cadmium oxide and bismuth oxide, organic vehicle and 0.1-4% by weight of silver.
Dependencies are inferred from the claim text.