Method of and apparatus for applying solder to metallic blanks

A solder applying apparatus comprising:

• a table, a turntable mounted on said table for holding and indexing a metallic blank in a substantially circular path successively through a series of work stations, a frame on said table, a supply of solder in strip form mounted on said frame, means on said frame above said table for intermittently feeding an increment of said solder strip against said blank at one of said work stations, means at said one work station for heating said blank and thereby said increment of solder strip via conduction through said blank substantially to the softening point of said solder to melt said solder increment onto said blank as an integral part thereof, said feeding means comprising a drive wheel and an idler wheel between which said solder strip extends, and means rotating said drive wheel in one direction to advance said strip against said blank and subsequently rotating said drive wheel in an opposite direction to retract said solder strip for severing the same from said molten increment of solder.

A solder applying apparatus comprising:

• a table, a turntable mounted on said table for holding and indexing a metallic blank in a substantially circular path successively through a series of work stations, a frame on said table, a supply of solder in strip form mounted on said frame, means on said frame above said table for intermittently feeding an increment of said solder strip against said blank at one of said work stations, and means at said one work station for heating said blank and thereby said increment of solder strip substantially to the softening point thereof to melt said solder increment onto said blank as an integral part thereof, said heating means comprising a heating plate supporting said blank at said one work station.

A solder applying apparatus comprising:

• a table, a turntable mounted on said table for holding and indexing a metallic blank in a substantially circular path successively through a series of work stations, a frame on said table, a supply of solder in strip form mounted on said frame, means on said frame above said table for intermittently feeding an increment of said solder strip against said blank at one of said work stations, means at said one work station for heating said blank and thereby said increment of solder strip substantially to the softening point thereof to melt such solder increment onto said blank, means at a subsequent work station for cooling said molten increment of solder to solidify the same as a bead on said blank as an integral part thereof, said feeding means comprising a drive wheel and an idler wheel having peripheral surfaces between which said solder strip extends, means for rotating said drive wheel in one direction to advance said strip against said blank and in an opposite direction to retract said strip and separate the same from said molten increment of solder, said heating means comprising a heating plate supporting said blank at said one work station, and means for resiliently mounting said heating plate on said table permitting slight displacement of said blank upon feeding of said solder strip increment thereagainst.