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US 4,229,758 AGranted
Package for semiconductor devices with first and second metal layers on the substrate of said package
AssigneeKyoto Ceramic Co., Ltd.
InventorKouji Ikari
Life of this patent
Estimating the term…
Abstract
A package for sealing an MOS type semiconductor element having a die-attach area comprising a first metal layer composed of gold and a second metal layer composed of a metal having a good bondability to aluminum metal, which is electrically connected to the first metal layer.
Claims3
A package for sealing an MOS type semiconductor element having a die-attach area comprising a first metal layer composed of gold and a second metal layer composed of a metal a good bondability to aluminum metal, which is electrically connected to the first metal layer.
Dependencies are inferred from the claim text.