Method and apparatus for capacitance testing printed circuit boards
AssigneeHoneywell Information Systems Inc.
InventorsDan F. Irick, Roger F. Zollinger
Life of this patent
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Abstract
This relates to a method and apparatus for testing printed circuit boards. The printed circuit board to be tested is placed on a metal plate and covered with a thin plastic film. The plastic film is coupled to the metal plate to form a substantially air-tight chamber occupied by the printed circuit board. A vacuum is then created in the chamber to secure the printed circuit board. A capacitance meter has a first terminal coupled to the metal plate and a second terminal coupled to a probe which is used to puncture the plastic film to make contact with electrical interconnects on the board.
Claims9
An apparatus for testing printed circuit boards having electrical interconnects therein, comprising:
- a metal base for supporting the printed circuit board to be tested;
- a plastic film disposed over said printed circuit board and coupled to said metal base;
- first means coupled to said metal base via said aperture for creating a vacuum in the region between said plastic film and said metal base for securely positioning said printed circuit board;
- and
- second means for measuring the capacitance between said metal base and the electrical interconnects on said printed circuit board.
A method for testing printed circuit boards having electrical interconnects thereon comprising:
- placing said printed circuit board on a metal base;
- covering said printed circuit board with a plastic film and coupling said plastic film to said metal base;
- creating a vacuum between said metal base and said plastic film whereby said printed circuit board is secured on said metal base by said plastic film;
- coupling one terminal of a capacitance meter to said metal base and a second terminal to a probe;
- and
- piercing said plastic film with said probe to make contact with said electrical interconnects.
Dependencies are inferred from the claim text.