Copolyamide resins from piperazine and polyoxyalkylene diamine having improved creep resistance

A thermoplastic copolyamide adhesive resin having improved creep resistance consisting essentially of the polymeric reaction product of essentially stoichiometric amounts of

• a mixture of saturated aliphatic dicarboxylic acids containing a long-chain dicarboxylic acid having from 8 to 14 carbon atoms and a short-chain dicarboxylic acid having from 2 to 7 carbon atoms, the equivalents ratio of long- to short-chain dicarboxylic acids ranging from 0.5:0.5 to 0.9:0.1, and
• a mixture of piperazine and a polyoxyalkylene diamine of the formula ##STR3## where R is hydrogen or a methyl group and m is a positive integer such that the average molecular weight of the polyoxyalkylene diamine is between about 200 and 800, the equivalents ratio of piperazine to polyoxyalkylene diamine ranging from 0.7:0.3 to 0.95:0.05, and containing an amount up to 20 percent, based on the total amine equivalents, of an aliphatic, cycloaliphatic or aromatic amine having 2 to 10 carbon atoms, a dipiperidyl type diamine selected from the group consisting of 1,2-di(4-piperidyl)ethane, 1,3-di(4-piperidyl)propane and 1,4-di(4-piperidyl)butane or an N-substituted piperazine or dipiperidyl type diamine wherein the substituent is an aminoalkyl or hydroxyalkyl radical having from 1 to 4 carbon atoms.