Spray cell for selective metal deposition or removal
AssigneeBell Telephone Laboratories, Incorporated
InventorsReginald R. Buckley, Paul A. Kohl
Life of this patent
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Abstract
A spray plating method is shown wherein a multiplicity of spray nozzles mounted on a feed pipe direct a high velocity spray at an article to be plated. The spray is deflected onto portions of the article by metal deflectors located near the article. The deflectors serve as the anode of the plating process. This results in a high current density and a high plating rate. The method is advantageously used for hard plating gold onto connector pins or other articles on a continuous strip-plating line. In another application, metal may be selectively removed from an article. Different portions of an article may have different amounts of metal deposited or removed.
Claims4
A method of manufacturing an article including the step of selectively electrochemically processing a portion of the article by steps comprising directing at the article a spray of electrochemical processing fluid, with the article being a first electrode of the electrochemical process, and the spray conducting electric current between said first electrode and a second electrode of the electrochemical process, the invention CHARACTERIZED in that said spray comprises two or more fan-shaped spray portions produced by two or more spray nozzles, with said spray having a Reynold's number of at least 10,000, and further characterized in that said second electrode comprises one or more deflectors that intersect said spray at an included angle less than 45 degrees and thereby deflect the spray onto the portion of the article to be selectively processed, with the deflectors extending to a point closer than 10 millimeters from the portion of the article to be selectively processed.
Dependencies are inferred from the claim text.