Resin composition having low shrink properties
AssigneeHitachi Chemical Company, Ltd.
InventorsIwao Maekawa, Isao Uchigasaki, Noboru Monma
Life of this patent
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Abstract
A resin composition which comprises (A) 50 to 90 parts by weight of an unsaturated ester oligomer produced by reacting a glycol, hydroxylated dicyclopentadiene, and at least one unsaturated dibasic acid or anhydride thereof until an acid value of less than 40, (B) 50 to 10 parts by weight of one or more polymerizable monomers, and (C) 3 to 15 parts by weight of polystyrene based on 100 parts by weight of the total of the components (A) and (B), can give molded articles having low shrink properties and improved color shading, cracks, etc.
Claims15
A resin composition having low shrink properties which comprises
- (A) 50 to 90 parts by weight of an unsaturated ester oligomer produced by carrying out condensation reaction of a glycol and hydroxylated dicyclopentadiene in an amount of 100 to 200% by mole per mole of the glycol with at least one unsaturated dibasic acid or anhydride thereof until an acid value of less than 40,
- (B) 50 to 10 parts by weight of one or more polymerizable monomers having one or more polymerizable double bonds in the molecule, and
- (C) 3 to 15 parts by weight of polystyrene based on 100 parts by weight of the total of the components (A) and (B).
Dependencies are inferred from the claim text.