Method of depositing a stress-free electroless copper deposit
AssigneeWestern Electric Company, Inc.
InventorsWilliam M. Beckenbaugh, Kim L. Morton
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Abstract
A method of depositing a stress-free electroless copper deposit is disclosed. The method comprises contacting a catalyzed surface with a solution comprising a source of cupric ions; a reducing agent for the cupric ions; a complexing agent for the solution selected from (a) ethylenediaminetetraacetic acid, (b) a salt of (a), (c) a modified ethylenediamine acetic acid, (d) a salt of (c), and (e) a mixture of at least two of the foregoing complexing agents; a stabilizer for the solution comprising a mercury compound; and an accelerator for the solution comprising a water-soluble compound containing a cyanide radical (CN.sup.-) complexed with a metal selected from Group VIII of the Periodic Table of the Elements.
Claims41
A method of depositing a stress-free copper deposit on a surface which comprises contacting a catalyzed surface with a solution comprising:
- (a) a source of cupric ions;
- (b) a reducing agent for said cupric ions;
- (c) a complexing agent for the solution selected from the group consisting of (1) cyclohexendiaminetetraacetic acid, (2) a salt of (1), and (3) a mixture of the foregoing complexing agents;
- (d) a stabilizer for the solution comprising a mercury compound;
- and
- (e) an accelerator for the solution comprising a water-soluble compound containing a cyanide radical complexed with a metal selected from Group VIII of the Periodic Table of the Elements.
A method of rendering an electroless copper deposition solution capable of having deposited therefrom a stress-free copper deposit which comprises combining in the solution:
- (a) a complexing agent for the solution selected from the group consisting of (1) cyclohexendiaminetetraacetic acid, (2) a salt of (1), and (3) a mixture of the foregoing complexing agents;
- (b) a stabilizer for the solution comprising a mercury compound;
- and
- (c) an accelerator for the solution comprising a water-soluble compound containing a cyanide radical complexed with a metal selected from Group VIII of the Periodic Table of the Elements.
An aqueous electroless plating solution capable of depositing therefrom an essentially stress-free copper deposit comprising:
- (c) a source of cupric ions;
- (b) a reducing agent for said cupric ions;
- (c) a complexing agent for the solution selected from the group consisting of (1) cyclohexendiaminetetraacetic acid, (2) a salt of (1), and (3) a mixture of the foregoing complexing agents;
- (d) a stabilizer for the solution comprising a mercury compound;
- and
- (e) an accelerator for the solution comprising a water-soluble compound containing a cyanide radical complexed with a metal selected from Group VIII of the Periodic Table of Elements.
An article of manufacture comprising a substrate and a stress-free copper deposit on at least one surface thereof, deposited from an electroless copper plating solution comprising:
- (a) a source of cupric ions;
- (b) a reducing agent for said cupric ions;
- (c) a complexing agent for the solution selected from the group consisting of (1) cyclohexendiaminetetraacetic acid, (2) a salt of (1), and (3) a mixture of the foregoing complexing agents;
- (d) a stabilizer for the solution comprising a mercury compound;
- and
- (e) an accelerator for the solution comprising a water-soluble compound containing a cyanide radical complexed with a metal selected from Group VIII of the Periodic Table of Elements.
Dependencies are inferred from the claim text.