Copper-boron carbide composite particle and method for its production
AssigneeKennecott Copper Corporation
InventorChih-Chung Wang
Life of this patent
Estimating the term…
Abstract
A process for manufacturing radiation shield structures of the type consisting of neutron absorbing boron carbide particles embedded in a copper matrix. The material comprises a multiplicity of particles comprising a core of boron carbide, a film of electroless copper bonded to the carbide, and a relatively thick electrodeposited copper layer bonded to the film. The particles are then consolidated to produce shield structures by hot rolling or hot pressing, with or without sintering.
Claims11
A process for encapsulating particulate boron carbide core materials within copper metal to produce discrete particles suitable for use in fabricating boron carbide core material-filled copper structures having a selected copper/boron carbide core material volume ratio, said process comprising the steps of:
- (A) placing the particulate boron carbide core material in a copper containing solution suitable for electroless copper plating and electrolessly plating an electrically conductive film of copper metal on said boron carbide core material to produce copper coated boron carbide particles;
- (B) electrolytically depositing additional copper onto said copper coated boron carbide particles;
- and
- (C) terminating the electrodeposition when particles of copper coated boron carbide having a selected copper/boron carbide core material volume ratio is achieved.
A material for producing copper, boron carbidefilled, neutron abosrobing shield structures, said material comprising a multiplicity of particles suitable for being fused to form a unitary structure by rolling, pressing, or sintering, each said particle comprising:
- a core particle of boron carbide;
- a thin film of electroless copper bonded to said core particle;
- and
- a layer of electrodeposited copper metal bonded to said film and encapsulating said core particle, the copper/boron carbide volume ratio being within the range of 0.3 to 4.
A process for producing a neutron absorbing, shield structure, said process comprising the steps of:
- (A) placing a particulate boron carbide core material in a copper containing solution suitable for electroless copper plating and electrolessly plating an electrically conductive film of copper metal on said boron carbide core material to produce copper coated boron carbide particles;
- (B) electrolytically depositing additional copper onto said copper coated boron carbide particles;
- (C) terminating the electrodeposition when particles of copper coated boron carbide having a copper/boron carbide core material volume ratio between the range of 0.3 to 4 is achieved;
- and,
- (D) consolidating said particles of copper coated boron carbide to produce a structure having a thickness sufficient to provide a boron carbide particle intercepting all lines passing therethrough.
Dependencies are inferred from the claim text.