Method for the electrical bonding of thin film tantalum capacitor networks to other networks
AssigneeSiemens Aktiengesellschaft
InventorsWilfried Anders, Werner Piepenburg
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Abstract
A method for electrically bonding tantalum thin film capacitor networks to other networks is described. A first non-conducting support member has a thin film tantalum capacitor mounted thereon. A second non-conducting support member has another component such as a resistor mounted thereon. The two non-conducting support members are placed in a back-to-back position so that the thin film tantalum capacitor and the other component are remote from each other. These two non-conducting support members are then bound together and dipped into a molten solder bath to form a solder coating on the metal elements of the completed network.
Claims1
A method for electrically bonding a network including at least one alpha-tantalum capacitor with another network containing at least one other component, such as a tantalum resistor network, including the steps of:
- mounting said alpha-tantalum capacitor on a first non-conducting substrate having metal elements;
- mounting said other component on a second non-conducting substrate having metal elements;
- placing said first and second non-conducting substrates back to back so that said capacitor and said other component are remote from one another;
- electrically bonding said capacitor to said other component to form a bonded network by connecting said first and second substrates together with electrical contact elements;
- dipping said bonded network into a molten solder bath to form a solder coating on said metal elements of said first and second non-conducting substrates and the ends of said contact elements to interconnect said metal elements on said first and second non-conducting substrates and couple said first and second non-conducting substrates together in a back-to-back relationship.
Dependencies are inferred from the claim text.