Thin-film microcircuit board

A thin-film microcircuit board comprising:

• a dielectric substrate;
• a thin-film laminate deposited on said dielectric substrate, said thin-film laminate comprising a lower layer consisting of a thin film of an oxide of a dispersion-metal dispersible and evaporable upon irradiation of a high-intensity light having an energy above a threshold value and an upper layer of an electrical property-imparting thin film formed of a transparent material constituting a conductive film, said dispersion-metal being at least one material selected from the group consisting of Bi, Ti, Sb, Al, Ge, Zn, Pb, In and alloys thereof and having a thickness between 50 and 5000 A, and said electrical property-imparting film being formed of at least one material selected from the group consisting of Au, Pt, Pd, In.sub.2 O.sub.3 and SnO.sub.2 ;
• said thin-film laminate having dispersed portions and undispersed portions formed by dispersion of said disperson metal;
• and
• a pattern circuit of the electrical property-imparting film on the undispersed portions of the laminate.

A thin-film microcircuit board comprising:

• a dielectric substrate;
• and
• a thin-film laminate deposited on said dielectric substrate, said thin-film laminate comprising an upper layer consisting of a thin film of a disperson metal dispersible and evaporable upon application of an energy above a threshold value, and a lower layer consisting of an electrical property-imparting film formed of a noble metal constituting a conductive film, said dispersion metal thin film having a thickness between 100 and 5000 A and being formed of a member selected from the group consisting of Bi, Te, Ni, Cu, Sn, Ni, Pb, Zn, Se, Ge, Co, Fe, Ti, Sb, Al, Cd and alloys thereof, said electrical property-imparting film having a thickness between 50 and 5000 A and being formed of a member selected from the group consisting of Ag, Au, Pt, Ru, Pd, Os, Ir, In.sub.2 O.sub.3 and SnO.sub.2 ;
• said thin film laminate being formed in a circuit pattern as a result of dispersion and evaporation thereof by application of an energy above a threshold value.

A hybrid microcircuit board comprising:

• (a) a heat-stable dielectric substrate;
• and
• (b) a laminate deposited on said dielectric substrate, said laminate comprising a thin-film of a dispersion-metal dispersible and evaporable by the exposure of radiation of an energy above a threshold value and having a thickness between 100 and 5000 A, and a noble metal thin film having a thickness between 50 and 5000 A, said noble metal being selected from the group consisting of Ag, Au, Pt, Ru, Rh, Pd, Os and Ir, and being, upon said exposure to radiation, free of dispersion and being dispersible in the form of said laminate,
• (c) said laminate being patterned by the exposure of radiation of an energy sufficient to cause dispersion of said dispersion-metal thin film to thereby remove exposed portions of the laminate, said noble metal thin film providing a conductive circuit film and a resistive film,
• (d) said microcircuit board being heat treated to stabilize said conductive circuit film and resistive film.

A transparent electrode structure comprising:

• (a) a glass substrate;
• and
• (b) a laminate deposited on said glass substrate, said laminate comprising a thin film of an oxide of a dispersion-metal dispersible and evaporable upon a high intensity of radiation having an energy above a threshold value and having a thickness between 100 and 5000 A, said dispersion metal including at least one selected from the group consisting of Bi, Ti, Sb, Al, Ge, Zn, Pb, In and alloys thereof and a transparent conductive thin film of a material selected from the group consisting of In.sub.2 O.sub.3, SnO.sub.2, Au, Pt and Pd and having a thickness between 50 and 5000 A, and
• (c) said laminate being patterned by application of said radiation energy sufficient to pattern said laminate.