Composite flanged ceramic package for electronic devices
AssigneeMicrowave Semiconductor Corp.
InventorWilliam Fitzgerald
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Abstract
An improved ceramic-based package for electronic devices having a composite flange for heat dissipation comprising a layer of heat conducting metal having a thermal coefficient of expansion appreciably different from that of the base secured to the base and a second layer of metal secured to the first layer having a thermal coefficient of expansion approximately equal to that of the ceramic. In a preferred embodiment, the first layer is copper, and the second is molybdenum.
Claims6
In a package for electronic devices of the type comprising a heat conducting ceramic base member and a metal flange secured to said base for dissipating heat from said base, the improvement wherein said flange comprises a bi-layer composite bi-metallic flange comprising a first layer of heat conducting metal having a thermal conductivity and a thermal coefficient of expansion appreciably greater than that of said base and, on the side of said first layer opposite said ceramic base, a second layer of metal secured to said first layer having a thermal coefficient of expansion approximately equal to that of the ceramic.
Dependencies are inferred from the claim text.