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US 4,226,896 AGranted
Plasma method for forming a metal containing polymer
AssigneeInternational Business Machines Corporation
InventorsJohn W. Coburn, Eric Kay
Life of this patent
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Abstract
A plasma process for forming a polymer film containing metal therein includes the steps of providing an electrode of a metal that can be etched by a halogen, providing a substrate for the polymer film to be deposited thereon, and passing a halocarbon monomer through a plasma system so that the metal etched from the electrode forms a volatile halide and is incorporated in the polymer film that is deposited on the substrate.
Claims8
A plasma process for forming a polymer film containing metal therein comprising the steps of:
- providing a closed vacuum system having gas input means and gas exhaust means;
- providing a first electrode in said system of a metal adapted to be plasma etched by a halogen to form a volatile halide;
- providing a substrate in said system in spaced relation to said first electrode and adapted to have a polymer film deposited thereon;
- passing a halocarbon monomer through said system, said monomer plasma etching said first electrode to form a volatile halide and forming at the same time a stable polymer on said substrate when a glow discharge is established by the application of a suitable voltage to said first electrode;
- and
- applying a suitable voltage to said first electrode whereby metal plasma etched from said first electrode is incorporated into the polymer film that is deposited on said substrate.
3 more elements
Dependencies are inferred from the claim text.