US 4,225,900 AGranted

Integrated circuit device package interconnect means

AssigneeRaytheon Company

InventorsJoseph A. Ciccio, Rudolf E. Thun, Harry J. Fardy

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Abstract

An integrated circuit device package is disclosed wherein a pair of dielectric support structures are provided, each one having a pattern of electrical conductors for interconnecting integrated circuit devices disposed thereon. The electrical conductors have end portions terminating into a plurality of contact pads disposed on a first surface of the support structures. A first one of the pair of support structures has corresponding contact pads on a second, opposite surface of the support structure, each one of the contact pads on the first surface being electrically connected to a corresponding one of the contact pads on the second surface. A dielectric spacer having a plurality of electrical contact pins is disposed between the pair of support structures. One end of each pin is electrically connected to a corresponding one of the contact pads disposed on the second surface of the first one of such structures, and the other end of such contact pin is electrically connected to a corresponding one of the contact pins disposed on the first surface of the second one of the structures. The contact pins are relatively short and thereby provide a relatively short electrical interconnect for the integrated circuit devices, thereby reducing parasitic capacitances normally associated with electrical interconnects.

Claims5

Dependent claims

An electrical interconnect system comprising:

(a) a pair of substrates, each one thereof having a pattern of conductors formed on first surfaces thereof with end portions of such conductors providing a plurality of contact pads on the first surfaces;
(b) a plurality of integrated circuit chips bonded to the conductors formed on the first surfaces of the pair of substrates;
(c) a pair of dielectric support structures each one having a corresponding plurality of contact pads disposed on first surfaces of such support structures, a first one of the pair of support structures having a corresponding plurality of contact pads formed on a second, opposite, surface of such structure, each one of the contact pads on the first surface of such first one of the dielectric support structures being electrically connected to a corresponding one of the contact pads on the second surface thereof, each one of the pair of substrates having a second surface bonded to the first surface of a corresponding one of the dielectric support structures;
(d) a plurality of connectors, each one thereof electrically connected between one of the plurality of contact pads formed on the first surface of the pair of dielectric support structures and a corresponding one of the contact pads formed on the one of the pair of substrates bonded to the first surface of such dielectric support structure;
and
(e) a dielectric spacer having a plurality of electrical contact pins passing therethrough, such spacer being disposed between the pair of dielectric support structures, one end of each contact pin being electrically connected to a corresponding one of the contact pads formed on the second surface of the first one of the dielectric support structures and the other end of such contact pin being electrically connected to a corresponding one of the contact pads on the first surface of the second one of the support structures.

3 more elements

Dependencies are inferred from the claim text.