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US 4,225,691 AGranted
Low temperature curable organic resin compositions
AssigneeGeneral Electric Company
InventorJames V. Crivello
Life of this patent
Estimating the term…
Abstract
Low temperature curable organic resin compositions, for example, epoxy resins are provided, which can be either exothermically cured or cured in several minutes or less at relatively low temperatures. Certain diaryliodonium salts have been found to spontaneously release strong protonic acids when used in combination with a copper salt and a reducing agent.
Claims13
A curable composition comprising by weight,
- (A) a cationically polymerizable organic resin, and
- (B) an effective amount of a curable composition of a catalyst consisting essentially of
- (i) a diaryl iodonium salt
- (ii) 0.1 to 10 parts, per part of (i) of a copper salt and
- (iii) 0.5 part to 10 parts, per part of (i) of an organic or inorganic compound or polymer capable of lowering or reducing the change of the hetero atom of the diaryliodonium salt.
2 more elements
A curable composition comprising by weight
- (C) a cationically polymerizable organic resin,
- (D) an effective amount of the curable composition of a mixture of
- (iv) a diaryliodonium salt of the formula,
- [(R).sub.a (R.sup.1).sub.b I][MQ.sub.d ].sup.-,
- (v) 0.1 part to 10 parts, per part of (iv) of a copper salt and
- (vi) 0.5 part to 10 parts, per part of (iv), of a reducing agent,
- where R is a monovalent aromatic organic radical, R.sup.1 is a divalent aromatic organic radical, M is a metal or metalloid, Q is a halogen radical, a is a whole number equal to 0 or 2, b is a whole number equal to 0 or 1, and when a is 0, b is equal to 1, and when b is 0, a is equal to 2.
4 more elements
Dependencies are inferred from the claim text.