Method for locally enhancing electroplating rates
AssigneeInternational Business Machines Corporation
InventorsRobert L. Melcher, Robert J. von Gutfeld
Life of this patent
Estimating the term…
Abstract
A method for high resolution maskless electroplating is described. Preferential plating results from exposing those regions where enhanced plating is sought to a collimated energy beam. Such exposure can produce an enhancement in the plating rate of 10.sup.3, which is sufficient to eliminate the necessity of masking the surface.
Claims15
A method for electroplating a metal onto selective regions of the surface of a cathode comprising:
- placing the cathode in a non-photo decomposable electrolyte;
- placing an anode in said electrolyte and spaced apart from said cathode;
- directing a focusable beam of energy having an intensity between about 10.sup.2 W/cm.sup.2 and 10.sup.6 W/cm.sup.2 to heat said regions of said surface to be preferentially plated;
- and
- establishing an electrical potential between said anode and said cathode while said surface is heated by said energy beam to preferentially electroplate metal on said region.
In a method for preferential electroplating of a metal onto regions of the surface of a cathode employing a non-photo decomposable electrolyte and an anode, the improvement comprising:
- directing a light beam having an intensity of at least 10.sup.2 W/cm.sup.2 to heat the region of the surface where preferential plating is sought and applying an electroplating potential while said region is heated by said light beam to preferentially electroplate metal on said region.
Dependencies are inferred from the claim text.