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US 4,208,760 AGranted
Apparatus and method for cleaning wafers
AssigneeHuestis Machine Corporation
InventorsJeffrey L. Dexter, William E. Fairweather, Harold R. Shurtleff
Life of this patent
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AssigneeHuestis Machine Corporation
InventorsJeffrey L. Dexter, William E. Fairweather, Harold R. Shurtleff
Estimating the term…
Apparatus and method in which a number of thin, disc-like wafers are moved in an arcuate path while supported in a generally upright position. While so supported, the wafers are indexed between a plurality of cleaning stations which may include a scrub station, a scrub rinse station, a rinse station, and a dry station. In the scrub rinse and/or scrub station, the wafers are rotated while contacted on opposite surfaces thereof by a pair of rotating brushes disposed in a closed position, which brushes may be moved to an open position to accommodate movement of the wafers therebetween. Furthermore, a bracket of unique construction serially moves the wafers into the travel path. Means for introducing the wafers to the path and for removing them therefrom are further included.
Apparatus for cleaning material wafers of disc-like form comprising, a frame, an arcuate travel path disposed with respect thereto, said path having a plurality of wafer treatment stations disposed at spaced locations therealong, including a wafer load station, a wafer discharge station and multiple wafer cleaning stations disposed therebetween, said path defined by a track supported by said frame and adapted to contact and at least partially support said wafer while positioned in said cleaning stations, a bracket assembly adapted to receive said wafer in a generally vertical disposition, said bracket assembly including inwardly projecting fingers for supporting said wafer by contacting opposite side edges thereof, and means for indexing said bracket assembly with respect to said track along said path through each of said stations.
Dependencies are inferred from the claim text.