Plain bearing laminate having slide-layer alloy based on copper-lead-tin
AssigneeGlyco-Metall-Werke Daelen & Loos GmbH
InventorsErich Roemer, Fritz Niegel
Life of this patent
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Abstract
A multi-layered plain slide bearing having a metal base layer, and having a slide layer which is carried by the base layer and which comprises a copper-lead-tin binary or ternary alloy that has been applied to the base layer and that has an unusually high cooper content. The slide layer can contain, by weight, from 20% to 70% of copper, at least 15% and at the most 80% of lead, and from 0% to 30% of tin, and can also optionally contain indium, cadmium or other like metals. The slide bearing can further include a run-in layer which covers the slide layer, and which contains copper, tin, indium and/or lead or their oxides, sulfides or phosphides.
Claims18
A multi-layered plain slide bearing having a base layer and having a slide layer carried by said base layer, said slide layer being constituted of an electrochemically-deposited alloy which substantially contains by weight from 20% to 70% of copper, at least 15% and at most 80% of lead, and from 0% to 30% of tin, said slide layer having a thickness of from 0.002 mm to 0.1 mm.
A multi-layered plain slide bearing having a base layer, and having a slide layer carried by said base layer, said slide layer being constituted of a gaseous phase precipitant alloy, which substantially contains by weight from 20% to 70% of copper, at least 15% and at most 80% of lead and from 0% to 30% of tin, and which has a thickness of from 0.002 mm to 0.1 mm.
Dependencies are inferred from the claim text.