Solder bearing terminal
AssigneeNorth American Specialties Corporation
InventorJack Seidler
Life of this patent
Estimating the term…
Abstract
A terminal clip for attachment to a contact pad on a substrate having one or two individual masses of solder mechanically engaged with the clip in a position to be melted for bonding the clip to one or two surfaces of the contact pad.
Claims9
A terminal clip for securement to a contact pad on a substrate comprising an elongated clip body portion having a free end and a stem end, said body portion being cut longitudinally along two lines to define a central finger between spaced portions of the body portion, said finger being bent out of the plane of the body portion at approximately the point of attachment of said finger to the body portion, the free end of said body portion beyond said point of attachment constituting at least one additional finger and being bent out of the plane of the body portion in the same direction as the central finger, said central finger and additional finger defining a gap to receive the substrate, and a discrete mass of solder, the central finger being wrapped at least 180.degree. around said mass of solder and indented into the surface of said mass for holding said mass of solder in a position adjacent said gap and on the side thereof nearer the stem end of the body portion.
A terminal clip for securement to a contact pad on a substrate comprising an elongated clip body portion having a free end and a stem end, said body portion being cut longitudinally along two lines to define a first finger between spaced portions of the body portion, said first finger being bent out of the plane of the body portion at approximately the point of attachment of said first finger to the body portion, the free end of said body portion beyond said point of attachment constituting at least one additional finger and being bent out of the plane of the body portion in the same direction as said first finger, said first finger and additional finger defining a gap to receive the substrate, and a discrete mass of solder, one of said fingers being wrapped at least 180.degree. around said mass of solder and indented into the surface of said mass for holding said mass of solder in a position adjacent said gap and on the side thereof nearer the stem end of the body portion.
A terminal clip for securement to a contact pad on a substrate comprising a clip body portion, a plurality of contact fingers projecting from an end of the body portion and bent out of the plane of the body portion to define a gap adapted to receive the edge of a substrate, and a discrete mass of solder, said fingers including a pair of fingers spaced laterally apart and located distally of the clip and a central finger having a width corresponding substantially to the distance between said spaced fingers, said central finger including means wrapped at least 180.degree. around said mass of solder and indented into the surface of the solder mas for holding said mass of solder in a position adjacent said gap and on the side thereof nearer the clip body portion.
Dependencies are inferred from the claim text.