Detachable aligning pin for die assembly

In a die assembly, an improved aligning pin arrangement, comprising:

• relatively movable first and second dies,
• a plurality of guide pin assemblies mounted on said first die and an equal plurality of aligning passageways formed in said second die for receiving associated ones of said guide pin assemblies to align said first and second dies,
• each of said guide pin assemblies including a first section mounted within said first die and a second aligning pin section connected to said first section, said second aligning pin sections extending above the surface of said first die for entering an associated one of said plurality of aligning passageways in said second die for aligning said first and second dies,
• each of said second aligning sections being detachably connected to a respective first section so that each of said second aligning pin sections may be detached from its respective first section after said first and second dies have been aligned, and
• a plurality of replacement second sections for replacing said detached aligning pin sections, each of said replacement sections having an outer annular wall including oppositely disposed first and second circumferential portions, said first circumferential portion of the outer wall of each of said replacement second sections having a larger radial dimension than the radial dimension of said second circumferential portion of said outer wall to compensate for uneven expansion of said first and second dies.