Process for fabrication of fuse and interconnects
AssigneeHarris Corporation
InventorHugh C. Nicolay
Life of this patent
Estimating the term…
Abstract
Fuses and interconnects are fabricated by applying a metallic layer on a substrate and a fusible layer on the metallic layer. Portions of the fusible layer are removed to define discrete fuse elements having a necked portion. Portions of the metallic layer are removed to define interconnects. A portion of the metallic layer coextensive with the necked portion of the fuse elements is removed by selective side etching to form tapering portions separated by a gap without etching of the interconnects. The interconnects are protected from side etching by a separate mask layer or a mask layer used to form the interconnects may be heated to flow down over the sides of the interconnects.
Claims9
A method for fabricating thin film fuses on a substrate comprising:
- applying a first layer of metallic material on said substrate;
- applying a second layer of fusible material on said first layer;
- first selectively removing portions of said second layer to define a fuse element;
- second selectively removing portions of said first layer, except for portions coextensive with said fuse element, to define interconnects;
- and
- third selectively removing a portion of said coextensive portion of said first layer between the ends of said fuse element by side etching without affecting said fuse element and interconnects.
A method of fabricating thin film fuses and interconnects on a substrate comprising:
- applying a first layer of metallic material on said substrate;
- applying a second layer of fusible material on said substrate;
- selectively removing portions of said second layer to define a discrete fuse element;
- applying a mask layer on said substrate to define interconnects with said fuse element exposed;
- etching through openings in said mask layer to form said interconnects;
- heating said mask layer sufficiently to flow down over the edges of said interconnects;
- and
- side etching exposed portion of said first layer coextensive with said fuse element to remove a sufficient portion of said exposed portion of said first layer to form a gap under said fuse.
Dependencies are inferred from the claim text.