Lateral PNP or NPN with a high gain
AssigneeInternational Business Machines Corporation
InventorsNarasipur G. Anantha, Harsaran S. Bhatia, Santosh P. Gaur, Hans B. Pogge
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Abstract
Lateral PNP or NPN devices in isolated monocrystalline silicon pockets wherein silicon dioxide isolation surrounds the pocket and partially, below the surface, within the isolated monocrystalline region are described. The P emitter or N emitter diffusion is made over the portion of the silicon dioxide that partially extends into the monocrystalline isolated pocket. This structure reduces the vertical current injection which will give relatively high (beta) gain even at low base to emitter voltages.
Claims10
A lateral PNP transistor structure comprising:
- a monocrystalline silicon region isolated from other such regions by dielectric isolation;
- the said dielectric isolation partially extending into said silicon region below the surface of said silicon region;
- a P emitter region located above said partially extending isolation in said silicon region;
- P collector region and N base region within said silicon region;
- and
- electrical contacts to said emitter base and collector regions forming said PNP lateral transistor structure.
A lateral NPN transistor structure comprising:
- a monocrystalline silicon region isolated from other such regions by dielectric isolation;
- the said dielectric isolation partially extending into said silicon region below the surface of said silicon region;
- an N emitter region located above said partially extending isolation in said silicon region;
- N collector region and P base region within said silicon region;
- and
- electrical contacts to said emitter base and collector regions forming said NPN lateral transistor structure.
An integrated circuit comprising:
- a silicon semiconductor body composed of a substrate, an N type epitaxial layer and an N+ type layer at the interface between said substrate and said epitaxial layer, having regions of monocrystalline silicon isolated from one another by dielectric isolation;
- the said dielectric isolation partially extending into said regions of monocrystalline silicon below the surface of said silicon region;
- a PNP lateral transistor in at least one of said regions of monocrystalline silicon having its P emitter located over said partially extending dielectric isolation;
- an NPN vertical transistor located in at least another of said regions of monocrystalline silicon;
- and
- electrical contacts to the emitter, base and collector contacts for said PNP and NPN transistors.
An integrated circuit comprising:
- a silicon semiconductor body composed of a substrate, a P type epitaxial layer and a P+ type layer at the interface between said substrate and said epitaxial layer, having regions of monocrystalline silicon isolated from one another by dielectric isolation;
- the said dielectric isolation partially extending into said regions of monocrystalline silicon below the surface of said silicon region;
- a NPN lateral transistor in at least one of said regions of monocrystalline silicon having its N emitter located over said partially extending dielectric isolation;
- a PNP vertical transistor located in at least another of said regions of monocrystalline silicon;
- and
- electrical contacts to the emitter, base and collector contacts for said NPN and PNP transistors.
Dependencies are inferred from the claim text.