Method of making a semiconductor light-emitting device utilizing low-temperature vapor-phase deposition
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsKunio Itoh, Morio Inoue
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AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsKunio Itoh, Morio Inoue
Estimating the term…
In order to decrease threshold current of a semiconductor laser, and to obtain a single mode lasing suitable for use in light-communication, the semiconductor laser is formed in stripe type in which the light-emitting (i.e., active) layer and neighboring layers are formed in mesa-etched stripe type and low impurity-concentration (i.e., high resistivity) layers of GaAs, GaAsP or GaAlAs are situated to contact the mesa-etched side faces of the stripe-shaped part on the semiconductor device by vapor phase growth, vacuum deposition, sputtering, or molecular beam deposition. Since the wafer temperature can be kept fairly low (e.g. 400.degree.-700.degree. C.) in comparison with that (about 950.degree. C.) in a liquid phase growth, the stress introduced during the deposition is smaller than that in a liquid phase growth.
A method of making a semiconductor light-emitting device comprising the following steps:
A method of making a double heterostructure semiconductor laser, comprising the following steps:
Dependencies are inferred from the claim text.