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US 4,180,442 AGranted
Electrodeposition of coatings on metals to enhance adhesive bonding
AssigneeMcDonnell Douglas Corporation
InventorNorman R. Byrd
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AssigneeMcDonnell Douglas Corporation
InventorNorman R. Byrd
Estimating the term…
The invention is directed to the electrodeposition of a coating of an organic compound or polymer on a metal such as aluminum, and the formation of a chemical bond between the metal and the coating. In the method for electrolytically depositing such coating on the metal substrate, e.g. aluminum, the substrate is employed as the anode in a non-aqueous electrolyte containing a coating compound, preferably a carboxyl-substituted aminosilane such as .gamma.-aminopropyltriethoxysilane, which has been reacted with any of various anhydrides such as phthalic, maleic, or succinic anhydride, and electrodepositing a coating on the metal substrate, the organic coating formed being chemically bonded to the substrate, thereby enhancing adhesive bonding to the metal substrate or enhancing spot weldability of such substrate, such coating being strongly bonded to the substrate and being corrosion resistant.
A process for enhancing adhesive bonding of a metal substrate and permitting spot welding thereof, which comprises passing an electric current through a non-aqueous electrolyte in which a metal substrate is the anode, the metal of said substrate being active and capable of forming an organometallic compound, said electrolyte containing an organic compound selected from the classes consisting of (a) carboxyl substituted aminosilanes, (b) butylamine reaction products with phthalic anhydride, decylamine reaction products with phthalic anhydride, and carboxyl terminated butadiene-acrylonitrile copolymer, and (c) phenyl phosphonic acid, and dimethyl phosphite, as their triethylamine salts, and sulfonic acid compounds.
A process for enhancing adhesive bonding of a metal substrate and permitting spot welding thereof, which comprises passing an electric current through a non-aqueous electrolyte in which a metal substrate is the anode, the metal of said substrate being active and capable of forming an organometallic compound, said electrolyte containing an organic compound having a labile hydrogen, and capable of generating an anion during electrolysis, and an inert organic solvent for said compound, and electrodepositing a coating of said compound on said metal substrate wherein said anion is reacted with and is chemically bonded to the metal of said substrate.
Dependencies are inferred from the claim text.