Heat recoverable article and methods using same

A heat recoverable article for sealing gaps between a plurality of substrates comprising a first and a second wafer of a heat-recoverable material, each of the wafers being a thin layer of a polymeric material which is heat-shrinkable in at least two directions in its plane such that each wafer recovers from its outer circumferential periphery towards its center, and a layer of adhesive positioned between and bonded to both of the wafers such that the wafers are at all times separated by the adhesive layer, the article having a plurality of apertures, each of which extends continuously through the first wafer, the layer of adhesive and the second wafer such that none of the adhesive is disposed within the apertures in the wafers before the recovery of the article, each aperture being adapted to receive a corresponding substrate extending through the article, whereby heating the article to the recovery temperature of the wafers causes each of the wafers to recover from its outer circumferential periphery towards its center such that each of the wafers recovers around each substrate, thereby drawing the adhesive layer down against each substrate to form a bond with the portion of each substrate which lies between the wafers, and provides strain relief for each substrate thereby forming a seal between each substrate and the article and sealing the gaps between the plurality of substrates.

A method for environmentally sealing the rear of an electrical connector of the type having a plurality of individually insulated electrical conductors extending from a tubular rear portion comprising the steps of:

• positioning the individually insulated electrical conductors through corresponding apertures extending continuously through the thickness of a heat recoverable sealing disc which comprises a first and a second wafer of a heat recoverable material, each of the wafers being a thin layer of a polymeric material which is heat-shrinkable in at least two directions in its plane such that each wafer recovers from its outer circumferential periphery towards its center, and a layer of adhesive positioned between and bonded to both of the wafers such that the wafers are at all times separated by the adhesive layer;
• positioning a heat shrinkable sleeve over the tubular rear position of the electrical connector and the periphery of the heat recoverable sealing disc;
• and
• heating the heat recoverable sealing disc and the heat-shrinkable sleeve to their recovery temperatures causing each of the wafers to recover from its outer circumferential periphery towards its center such that each of the wafers recovers around the conductors thereby drawing the adhesive layer down against the conductors to form a bond with the portion of each conductor which lies between the wafers, and causing a portion of the adhesive layer to be extended from the outer circumferential periphery of the heat recoverable sealing disc such that the extruded adhesive forms a bond with an interior surface portion of the heat shrinkable sleeve, and said heat shrinkable sleeve to recover around said tubular rear portion of the electrical connector thereby environmentally sealing the rear of the electrical conductor.