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US 4,169,976 AGranted
Process for cutting or shaping of a substrate by laser
AssigneeValfivre S.p.A.
InventorGian Franco Cirri
Life of this patent
Estimating the term…
Abstract
A process for cutting or shaping of a ceramic substrate with laser light, comprising pulsing the laser light and moving the pulsing laser light source with respect to the substrate so that individual light pulses strike different spots along the substrate, defining a path; the laser light may pierce the substrate.
Claims11
A process for providing openings in, scoring of or shaping of a substrate of a ceramic material, or the like, by laser, comprising the steps of:
- supplying a pulsed beam of laser light on the substrate portion to be drilled, scored or shaped, thereby producing a small size hole where each pulsed beam of light strikes the substrate;
- and
- in synchronized relationship with the light beam pulses, relatively moving the laser beam and the substrate with respect to each other so that the light beam pulses follow a path corresponding to the shape of the opening that has been drilled, the scoring path that has been scored or the shaping to be made in the substrate.
Dependencies are inferred from the claim text.