Gold electroplating bath and method of making the same
AssigneeAmerican Chemical & Refining Company Incorporated
InventorsAugustus Fletcher, William L. Moriarty
Life of this patent
Estimating the term…
Loading patent…
AssigneeAmerican Chemical & Refining Company Incorporated
InventorsAugustus Fletcher, William L. Moriarty
Estimating the term…
An aqueous bath for the electroplating of gold is particularly adapted for plating a gold strike on stainless steel and includes about 2 to 16.5 grams per liter of auric(III) gold in a cyanide complex. Potassium nitrate is employed as an electrolyte and ethylenediamine hydrochloride is added as a complexer. Nickel, cobalt, copper, tin, or indium ions may be present as an alloying ingredient for the gold and pH of the bath is not more than 4.0, preferably not more than 1.5. In the method of preparing the bath, an aqueous solution of potassium gold chloride KAu(Cl).sub.4 and potassium nitrate is prepared. Potassium cyanide is added to the solution and reacts with the potassium gold chloride to form a gold cyanide complex. Ethylenediamine hydrochloride is then added to the solution. The ethylenediamine hydrochloride may include nickel chloride or other salts to provide the alloying metal additives for the gold and hydrochloric acid may be added to adjust the pH.
An aqueous bath for the electrodeposition of gold comprising:
An aqueous bath for the electrodeposition of gold, comprising:
In a method of preparing an aqueous bath for the electrodeposition of gold, the steps comprising:
Dependencies are inferred from the claim text.