Electroplating chromium and its alloys
AssigneeInternational Business Machines Corporation
InventorsDonald J. Barclay, William M. Morgan
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Abstract
A chromium or chromium alloy plating system and material are disclosed. The chromium is supplied by an aqueous equilibrated solution of a chromium (III) thiocyanate complex. A buffer material which also supplies one of the ligands to the chromium complex is provided. The buffer material is selected from amino acids, peptides, formates, acetates and hypophosphites. DESCRIPTION Related Applications
Claims32
In a solution for electroplating chromium in which the source of chromium ions is an aqueous equilibrated solution of chromium(III) thiocyanate complex, the improvement which comprises,
- a buffer material in the solution, which buffer material provides one of the ligands for the complex, said buffer material being selected from the group consisting of amino acids, peptides, formates, acetates and hypophosphites.
In a method of plating chromium wherein an aqueous equilibrated solution of chromium(III) thiocyanate complex provided the source of chromium and wherein a current is passed through the solution to cause electrodeposition of chromium, the improvement which comprises,
- providing a buffer material in the solution, which buffer material provides one of the ligands for the complex, said buffer material being selected from the group consisting of amino acids, peptides, formates, acetates and hypophosphites.
Dependencies are inferred from the claim text.