Coagulation coating process
AssigneeFord Motor Company
InventorsRobert A. Swider, Gordon G. Strosberg
Life of this patent
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Abstract
A coagulation process for coating various substrates with organic resins which may be admixed with reactive or nonreactive particles. The process comprises (A) providing the substrate to be coated with a dry coagulating compound surface and (B) exposing said substrate to an aqueous bath comprising an organic film forming material, at least fifty (50) weight percent of which is a chemically ionizable organic film-former which (i) has at least 12 carbon atoms per molecule; (ii) is at least partially ionized such that it is substantially soluble in said aqueous bath; and (iii) coagulates in the presence of said coagulating compound.
Claims36
A process for coating a substrate comprising:
- (A) providing said substrate with a surface coating of a dry coagulating compound;
- and
- (B) exposing said coated substrate to an aqueous composition which, except for solvents, reactive and nonreactive pigments and other nonreactive particulate material, consists essentially of an organic film-forming material consisting essentially of
- (i) at least fifty (50) weight percent of a chemically ionizable, organic film-former which
- (a) has at least 12 carbon atoms per molecule,
- (b) is at least partially ionized such that it is substantially soluble in said aqueous composition, and
- (c) coagulates in the presence of said coagulating compound;
- and
- (ii) a remainder of an organic film-former which is not chemically ionizable.
A process for coating a substrate comprising:
- (A) providing said substrate with a surface coating of a dry coagulating compound;
- and
- (B) immersing said coated substrate in an aqueous bath which, except for solvent, consists essentially of:
- (1) between about 0.2 and about 40 weight percent based on the total weight of the bath of an organic film-forming material consisting essentially of
- (a) at least about fifty (50) weight percent of a chemically ionizable, organic film-former which
- (i) has at least 12 carbon atoms per molecule,
- (ii) is at least partially ionized such that it is substantially soluble in said aqueous bath, and
- (iii) coagulates and deposits on said substrate in the presence of said coagulating compound, and
- (b) a remainder of an organic film-former which is not chemically ionizable;
- and
- (2) particulate material which is
- (a) codeposited with said organic film-forming material, and
- (b) present in said aqueous bath in an amount such that the weight ratio of particulate material to organic film-forming material in said bath is in the range of 1:9 to 30:1.
A process for modifying the surface of a metal substrate of which the major component by weight is selected from cobalt, nickel and iron and constitutes at least 40 weight percent of said substrate, said process comprising
- (a) providing said substrate with a surface coating of a dry coagulating compound,
- (b) codepositing by coagulation on said metal substrate a coating of
- (I) metal particles having an average diameter in the range of 0.5 to 20 microns and selected from
- (A) aluminum comprising particles wherein the weight ratio of aluminum to other metal is in the range of 200:1 to 1:3 and which are selected from
- (1) aluminum alloy particles,
- (2) a mixture of aluminum particles and particles of at least one other metal,
- (3) a mixture of aluminum particles and particles of at least one metal oxide, and
- (4) a mixture of aluminum particles and particles of at least one alloy, or
- (B) aluminum particles;
- and (II) a heat fugitive organic film-forming material consisting essentially of at least 50 weight percent of a chemically ionizable, organic film-former having at least 12 carbon atoms per molecule and a remainder of organic film-former which is not chemically ionizable, in a metal particle to organic film-forming material weight ratio in excess of 3:1, from an aqueous dispersion forming a coating bath which, except for solvent, consists essentially of said metal particles and said organic film-forming material, said chemically ionizable organic film-former being at least partically ionized and adapted to coagulate and deposit in the presence of said coagulating compound, and wherein
- (A) the weight ratio of metal particles in said bath to organic film-forming material in said bath is maintained above 3:1,
- (B) the concentration of organic film-forming material in said bath is maintained in the range of about 0.2 to about 7 weight percent based on the total weight of the bath, and
- (C) the total weight of non-volatile solids in said bath is maintained below about 35 weight percent of said bath, and
- (C) heating said substrate and resultant codeposition coating thereon in a heating zone in an ambient essentially inert to said metal particles and said coating to a decomposition temperature above the temperature required to decompose the organic film-forming material in said coating and below the diffusion temperature of said metal particles, maintaining said decomposition temperature until said organic film forming material is essentially decomposed and gaseous products thereof are formed in said heating zone, essentially evacuating said gaseous products from said heating zone, maintaining said substrate in said heating zone in an ambient essentially inert to the metal particles and raising the temperature of said heating zone to a diffusion temperature of at least 50.degree. above melting point of aluminum and below about 2200.degree. F., and maintaining said diffusion temperature and said ambient for a time in excess of about 1 hour.
Dependencies are inferred from the claim text.