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US 4,151,637 AGranted
Dip component lead cut and clinch apparatus
AssigneeUniversal Instruments Corporation
InventorsAlbert W. Zemek, Crawford A. Matson
Life of this patent
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Abstract
An apparatus for simultaneously cutting and clinching both parallel rows of leads of DIP type electronic components. The apparatus operating adjacent the undersurface of a printed circuit board into which component leads have been inserted includes a cutter capable of clinching the lead rows either inward toward each other or outward.
Claims7
A first apparatus for simultaneously cutting and clinching a row of aligned leads of a DIP type electronic component, said leads inserted in and projecting beneath a circuit board, said apparatus including:
- a housing;
- a cutter, said cutter mounted for translating on a first surface of said housing, said cutter having an aligned row of spaced slots therethrough, said row of slots being aligned transversely to the direction of said translation, said slots spaced apart to receive therein said projecting component leads;
- a cover fixedly attached to said housing and adjacent said cutter with sliding contact therebetween, said cover including a first cutting edge adjacent said cutter, said first cutting edge sliding across said row of slots when said cutter is translated;
- and
- means to translate said cutter, whereby said component leads projecting beneath said circuit board and received in said slots are cut against said first cutting edge and clinched when said cutter is translated.
2 more elements
Dependencies are inferred from the claim text.