Wafer sawing technique

Abstract

A method for dividing a semiconductor wafer into pellets includes attaching the wafer to a vinyl membrane with a coupling material which adheres more tenaciously to the membrane than to the pellets and sawing completely through the wafer and at least partially through the coupling material to separate the wafer into discrete pellets. In accordance with a preferred method, the membrane is at least slightly cut by the saw to insure complete division of the wafer. The pellets are readily removed from the coated membrane without any residues remaining thereon from the coupling material. A resinous vinyl coupling material is preferred.

Dependencies are inferred from the claim text.