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US 4,127,619 AGranted
Polyethylene containing hot melt adhesives
AssigneeEastman Kodak Company
InventorDarryl A. Godfrey
Life of this patent
Estimating the term…
Abstract
The hot melt adhesives of the present invention comprise a blend of at least one polyethylene, a tackifying resin, and a high density, low viscosity polyethylene wax having a molecular weight of about 1000. This hot melt adhesive has a novel combination of properties including excellent elevated temperature properties.
Claims8
An adhesive composition capable of being used as a hot melt adhesive comprising a blend of
- (a) about 50 to 80 percent by weight of at least one polyethylene having a melt viscosity of 500 to 20,000 centipoise at 190.degree. C. and a density greater than 0.90 to about 0.97 g/cc.,
- (b) about 13 to 35 percent by weight of at least one tackifier resin selected from the group consisting of hydrocarbon resin and polyterpene resin, and
- (c) about 7 to 15 percent by weight of a high density, low viscosity polyethylene wax having a molecular weight of about 800 to 1200 and a Ring and Ball softening point in the range of 110.degree. to 120.degree. C.
An adhesive composition capable of being used as a hot melt adhesive comprising a blend of
- (a) about 62 weight percent of at least one polyethylene having a melt viscosity of 500 to 20,000 centipoise at 190.degree. C. and a density greater than about 0.90 to 0.97 g/cc.,
- (b) about 27 weight percent of at least one tackifier resin selected from the group consisting of hydrocarbon resin and polyterpene resin, and
- (c) about 11 weight percent of a high density, low viscosity polyethylene wax having a molecular weight of about 800 to 1200 and a Ring and Ball softening point in the range of 110.degree. to 120.degree. C.
Dependencies are inferred from the claim text.