Magazine apparatus for semiconductor processing device

In an automatic semiconductor bonder, prober or like device which operates with lead frames, trays, mounting strips or other holders or semiconductor wafers;

• an apparatus for handling such holders comprising:
• a generally rectilinear magazine having an interior for receiving at least one of said holders or wafers, the exterior of said magazine including a rack defined by a plurality of in-line teeth and mounting means for mounting said magazine for movement on said device;
• said mounting means includes a channel disposed generally parallel to said rack on the exterior of said magazine, said channel including an elongated outer opening more narrow than the inner width of said channel for engaging T-shaped mounts on said device;
• and,
• driving means coupled to said device for selectively moving said magazine in the direction of said in-line teeth, said driving means including a geneva movement having indexing pins which cooperatively engage said teeth;
• whereby said holders or wafers may be removed from a plurality of said magazines for bonding, probing or other operations.

In an automatic semiconductor bonder, prober or like device which operates with lead frames, trays, mounting strips, or other holders or with semiconductor wafers;

• an apparatus for handling such holders or wafers comprising:
• a plurality of magazines each having an interior for receiving at least one of said holders or wafers, the exterior of said magazines including teeth and mounting means for mounting said magazines for movement on said device, said teeth forming a rack on each of said magazines in-line with the direction of said movement;
• said teeth having a first pitch in the central region of each of said racks and a second pitch, greater than said first pitch, at the ends of each of said racks, said second pitch to compensate for the thickness of the end walls of said magazines;
• driving means coupled to said device for engaging said teeth to selectively provide said movement of said magazines relative to said device;
• whereby said magazines are automatically fed through such that said holders or wafers may be removed from said plurality of said magazines for bonding, probing or other operations.