Apparatus for cooling electrical components
AssigneeSony Corporation
InventorsHiroshi Arii, Hirohito Kawada, Takashi Yoshida, Chiaki Nonaka
Life of this patent
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Abstract
In a cooling assembly including a heat conductive block mounting an electronic part, and a heat pipe attached to the heat conductive block, a connector connected to the leads of the electronic part is arranged in the heat conductive block.
Claims8
In a cooling assembly including a heat generating electric part having leads, a heat conductive block mounting said heat generating electric part, and a heat pipe attached to said heat conductive block for radiating the heat from said heat generating electric part to the air through said heat conductive block, the improvement in which said heat-conductive block comprises a thickened portion combined with said heat pipe, and a thinned portion having two sides formed contiguously to said thickened portion, said heat generating electric part is mounted on said heat-conductive block so that at least one part of said heat generating electric part extends on one side of said thinned portion, and a connector is arranged on the other side of said thinned portion and connected to said leads of the heat generating electric part, in which said heat conductive block comprises first and second block members having thickened portions and thinned portions, grooves conforming with the shape of said heat pipe are made in said thickened portions, and said heat pipe is held between said grooves, in which said thinned portions of the heat conductive block are opposed to each other, extending obliquely from said thickened portions, so as to diverge from each other.
Dependencies are inferred from the claim text.