Small-size high-performance radiation thermopile
AssigneeLeeds & Northrup Company
InventorRonald Dale Baxter
Life of this patent
Estimating the term…
Abstract
A thermopile type radiation detector for use in radiation pyrometry having small size and high performance in which the thermopiles are formed by evaporating the thermocouple leads onto a thin substrate together with a pattern distribution of thermocouple junctions that produces an output that is more representative of the distributed radiant energy impinging on the hot junctions of the thermopile. The thermopile performance is improved also by the incorporation of relatively large reflecting areas associated with the region of the thermopile where the cold junctions are located.
Claims9
The method of fabricating a high performance solid-backed thin film thermopile using the steps of
- depositing on one surface of a crystalline wafer having a (1-0-0) crystal orientation a thin film of insulating material,
- depositing on said insulating material a plurality of serially connected thermocouples formed of dissimilar conducting materials with a series of junctions located in a central portion of said wafer and intermediate junctions spaced from and circumferentially distributed outside said central portion and
- anisotropically etching said water material from said insulating material in said central portion to remove said wafer material in said central portion to cause said series of junctions in said central portion to be supported solely by said thin film of insulating material.
The method of fabricating a high performance solid-backed thin film thermopile using the steps of
- depositing on one surface of a silicon wafer having a (1-0-0) crystal orientation a thin film of borosilicate glass,
- annealing said silicon wafer and deposited glass,
- depositing on said glass a plurality of serially connected thermocouples formed of dissimilar conducting materials with a series of junctions located in a central portion of said wafer and intermediate junctions spaced from and distributed about the perimeter of said central portion and
- selectively removing said silicon from said glass in said central portion by an orientation dependent etch to produce a central opening having a substantially rectangular shape sharply defined by the (1-1-1) planes of said silicon wafer.
An improved high-performance solid-backed thermopile for use in a radiation responsive temperature measuring device comprising
- a substrate formed of a thin film of insulating material,
- a support frame for said substrate having a substantially rectangular central aperature therethrough,
- a plurality of first thermocouple junctions deposited on the surface of said substrate in a target area within the area corresponding with the central aperature of said support frame,
- a plurality of second thermocouple junctions deposited on the surface of said substrate in the area supported by said support frame, and
- a plurality of thermocouple leads connecting said hot and said cold junctions alternately in series circuit relation, said leads at said hot junctions lying in a plane corresponding with the surface of said insulating film and being substantially perpendicular to each other
- whereby said hot junctions are distributed through said target area and the number of hot junctions that may be located in said target area is maximized for any preselected thermocouple lead spacing and target area.
An improved high-performance thermopile for use as a radiation pyrometer comprising
- a target area defined by a radiation receptor,
- a frame spaced from and surrounding said target area,
- a plurality of first thermocouple leads located in a plane,
- a plurality of second thermocouple leads located in said plane,
- a plurality of hot thermocouple junctions formed within and distributed through said target area by first junctions of said first and said second thermocouple leads with said leads connected to each of said hot junctions at substantially right angles to each other and
- a plurality of cold thermocouple junctions within an area defined by said frame formed by other junctions of said two dissimilar thermocouple leads with said leads connected to said cold junctions substantially parallel to each other.
Dependencies are inferred from the claim text.