Electrodeposition of copper
AssigneeOxy Metal Industries Corporation
InventorsHans-Gerhard Creutz, deceased, Roy W. Herr
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Abstract
A composition and method for electrodepositing ductile, bright, well leveled copper deposits from an aqueous acidic copper plating bath having dissolved therein from about 0.04 to about 1000 milligrams per liter of a poly (alkanol quaternary ammonium salt) formed as the reaction product of a polyalkanolamine with an alkylating or quaternization agent. The polyalkanolamine constituent typically is formed as the reaction product of a polyalkylenimine (e.g. polyethylenimine) with an alkylene oxide.
Claims6
A bath for electrodepositing copper comprising an aqueous acidic copper plating bath having dissolved therein about 0.04 to 1000 mg/l of a reaction product of an alkoxylated polyalkylenimine with an alkylating agent as defined below:
- ##STR6## wherein:
- R.sub.1 = alkylene group of 1-6 carbon atoms;
- R.sub.2 = alkylene group of 1-6 carbon atoms;
- ##STR7## R.sub.5 = alkyl group of 1-4 carbon atoms;
- aralkyl;
- alkenyl group of 2-4 carbon atoms;
- alkynyl group of 2-4 carbon atoms;
- alkylene sulfonate group of 1-4 carbon atoms (e.g. --CH.sub.2 CH.sub.2 CH.sub.2 SO.sub.3.sup..crclbar.);
- and ##STR8## R.sub.6 = H, --CH.sub.3, --CH.sub.2 OH;
- R.sub.7 = alkyl group of 1-4 carbon atoms;
- m = 1 to 2;
- X.sup..crclbar. = cl.sup..crclbar., Br.sup..crclbar., CH.sub.3 SO.sub.4.sup..crclbar. ;
- p = 1 to 2 and
- n = 7.0 to 23,500.
Dependencies are inferred from the claim text.