Method for preparing a multilayer ceramic

Abstract

A method for manufacturing a multilayer ceramic which is particularly suitable for carrying semiconductor chips. In order to join a semiconductor chip to a multilayer ceramic substrate, it is necessary that the projected site for the semiconductor chip be substantially flat. If there is a bulge, it becomes difficult to make a good joint thereto. The method involves depositing a particulate mixture containing a metal and the metal's oxide in a ratio of between 1:1 to 9:1 in a pattern on at least a portion of the plurality of ceramic layers. The patterns are then dried. The plurality of substrates or layers of ceramic are then laminated under substantial pressure and fired at an elevated temperature. The addition of the metal oxide to the metal powder allows the shrinkage of the metallization compound so that it may more nearly match that of the ceramic it is coated upon during the firing step. This matching of the shrinkage during firing prevents cracking of the ceramic.

Dependencies are inferred from the claim text.