Low-current contact construction
AssigneeSiemens Aktiengesellschaft
InventorsLothar Borchert, Karl-Jorg Stenzel
Life of this patent
Estimating the term…
Abstract
A low-current contact structure formed on a contact member or substrate of various layers is described. A layer of refractory material is connected via a layer of easily diffusive metal with a layer of noble metal through diffusion annealing.
Claims16
A contact structure, more particularly for telecommunications relay contacts, said contact structure consisting of:
- (a) a substrate of suitable conducting and/or magnetizable material;
- (b) a first layer bonded to said substrate, said first layer composed of a refractory metal selected from the group consisting of rhenium, tungsten, molybdenum and alloys thereof, having a thickness of from 0.02 to 0.08 mm;
- and
- (c) a second layer bonded to said first layer by diffusion annealing, said second layer composed of an alloy consisting of silver and palladium having a 10 to 50% palladium content and a thickness of from 0.005 to 0.2 mm.
A contact structure, more particularly for telecommunications relay contacts, said contact structure consisting of:
- (a) a substrate of suitable conducting and/or magnetizable material;
- (b) a first layer bonded to said substrate, said first layer composed of a refractory metal selected from the group consisting of rhenium, tungsten, molybdenum and alloys thereof, having a thickness of from 0.02 to 0.08 mm;
- and
- (c) a second layer bonded to said first layer by diffusion annealing, said second layer composed of an alloy consisting of silver, palladium and copper in the ratio of 65:30:5 percent by weight and having a thickness of from 0.005 to 0.02 mm.
A contact structure, more particularly for telecommunications relay contacts, said contact structure consisting of:
- (a) a substrate of suitable conducting and/or magnetizable material;
- (b) a first layer bonded to said substrate, said first layer composed of a refractory metal selected from the group consisting of rhenium, tungsten, molybdenum and alloys thereof, having a thickness of from 0.006 to 0.014 mm;
- and
- (c) a second layer bonded to said first layer by diffusion annealing, said second layer composed of an alloy consisting of silver and palladium having a 10 to 50% palladium content and a thickness of from 0.005 to 0.02 mm.
A contact structure, more particularly for telecommunications relay contacts, said contact structure consisting of:
- (a) a substrate of suitable conducting and/or magnetizable material;
- (b) a first layer bonded to said substrate, said first layer composed of a refractory metal selected from the group consisting of rhenium, tungsten, molybdenum and alloys thereof, having a thickness of from 0.006 to 0.014.
- (c) a second layer bonded to said first layer by diffusion annealing, said second layer composed of an alloy consisting of silver, palladium and copper in the ratio of 65:30:5 percent by weight and having a thickness of from 0.005 to 0.02 mm.
Dependencies are inferred from the claim text.