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US 4,072,771 AGranted
Copper thick film conductor
AssigneeBala Electronics Corporation
InventorJohn D. Grier, Sr.
Life of this patent
Estimating the term…
Abstract
A method of making a copper thick film conductor paste which includes the step of preoxidizing a controlled amount of the copper powder particles. A copper thick film conductor paste, and an electrical conductor element and a method of making it from the paste.
Claims14
A method of making a copper thick film conductor paste consisting essentially of
- taking a powder of fine copper particles,
- preoxidizing the surface of the fine copper particles to form an oxidized copper powder having a surface copper oxide,
- mixing the oxidized copper powder with a glass frit comprising about 1-10% by weight of the total solids in the solids mixture,
- said copper oxide being about 1 to about 5% by weight of the total solids in the solids mixture,
- and mixing the solids mixture with a volatile and decomposable fluid suspending vehicle to make a copper thick film conductor paste.
2 more elements
A copper thick film conductor paste adapted to be applied to and fired onto an insulating substrate to form an electrical conductor element, consisting essentially of
- a mixture of about 92-97% of free copper powder by weight of solids in the mixture,
- about 1-5% of copper oxide by weight of solids in the mixture,
- about 1-10% of glass frit by weight of solids in the mixture,
- and a volatile and decomposable fluid suspending vehicle.
1 more element
A method of making an electrical conductor element consisting essentially of the steps of
- taking a powder of fine copper particles,
- preoxidizing the copper to form an oxidized copper powder,
- mixing the oxidized copper powder with a glass frit comprising about 1-10% by weight of the total solids in the solids mixture,
- with the copper oxide being about 1- 5% by weight of the total solids in the solids mixture,
- mixing the solids mixture with a volatile and decomposable fluid suspending vehicle to form a copper thick film paste,
- applying the paste onto an insulating substrate,
- drying the paste on the substrate and evaporating the vehicle,
- and firing said substrate in an inert, non-oxidizing, non-reducing atmosphere to adehere said copper thereto.
5 more elements
Dependencies are inferred from the claim text.