Stripe on strip plating method

Abstract

An apparatus is described for selectively depositing a continuous stripe of one type of material on a strip of another type of material as the strip is transported through the apparatus on a path of spaced rails. The rails are provided for supporting the strip along its lateral edges. A weight or pressure in the form of a movable member is carried on the strip between tape-guiding means for forming a fluid-tight seal between the lateral edges of the strip and the rails. A plurality of fluid jets are provided in a line between the rails for jetting fluid against the strip. At opposite ends of the line of jets there is provided at least one fluid jet for jetting fluid inwardly against the back-spray of fluid from the strip for preventing the escape of spent fluid from between the rails and preventing plating in unwanted areas. Means are also provided for changing the width and position of the stripe on the strip by changing the relative position of the rails and strip-guiding means. For the electrodeposition of metal stripes, an electrode in the form of a wire mesh screen is employed between the jets and strip with means provided for providing an electrical potential between the screen and the strip.

Dependencies are inferred from the claim text.