Adhesively and magnetically holding an article

A method of handling a wafer of semiconductor material having an array of semiconductor devices formed therein, wherein the wafer has been adhered to a nonmagnetic support with an adhesive, which comprises the steps of:

• separating the wafer into individual devices;
• screening magnetic ink on the individual devices to make them magnetic;
• partially curing the ink;
• electrically testing the devices to determine the good ones;
• completing the curing of the ink;
• dissolving a portion of the adhesive;
• melting the remaining adhesive to free the devices from the magnetic support;
• transferring the devices to a magnetized carrier, the carrier having intersecting sets of parallel grooves and material selected from the group consisting of barrium ferrite, strontium ferrite, alnico, or a mixture of barrium and strontium ferrite;
• and
• placing the carrier in trichloroethylene solvent vapor and condensing the vapor to form the liquid solvent thereon, the solvent flowing over the surface and through the grooves in the carrier to rapidly and completely remove any adhesive transferred with the devices while the magnetic forces maintain the location and orientation of the devices on the carrier.