Poly(arylacetylene) molding compositions
AssigneeHercules Incorporated
InventorHarold Jabloner
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AssigneeHercules Incorporated
InventorHarold Jabloner
Estimating the term…
The invention relates to poly(arylacetylene) molding compositions and thermoset resins prepared therefrom. The molding compositions comprise blends of a polyacetylenically unsaturated prepolymer and from about 2 to about 70%, by weight of the prepolymer, of a monomeric acetylenically unsaturated aromatic compound having a melting point below about 185.degree. C. and a boiling point above about 250.degree. C. The polyacetylenically unsaturated prepolymer is a polymer of at least one polyacetylenically substituted aromatic compound, such as a diethynylbenzene, which prepolymer has a number average molecular weight of about 900 to 12,000 and contains about 5 to 20% by weight of acetylenic groups. Typical monomeric acetylenic aromatic compounds which are blended with the prepolymer are diphenylacetylene and diphenylbutadiyne.
A molding composition comprising a blend of (1) a prepolymer of at least one polyacetylenically substituted aromatic compound selected from the group consisting of diethynylbenzene;
The process of preparing a thermoset resin essentially free pf aliphatic unsaturation which comprises (1) in a first stage (a) preparing a prepolymer by polymerizing at least one polyacetylenically substituted aromatic compound by heating said compound with an aromatization catalyst in an inert organic diluent to a temperature of from about 55.degree. C. to about 250.degree. C. until from about 30% to about 90% of said compound has been converted to polymer, said compound being selected from the group consisting of diethynylbenzene;
Dependencies are inferred from the claim text.