Aluminium soldering composition
AssigneeMulticore Solders Limited
InventorsGordon Francis Arbib, Bernard Michael Allen
Life of this patent
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Abstract
There is described a composition for soft soldering aluminium or alloys thereof using a fluxed solder composition. The fluxed solder composition comprises a soldering flux suitable for use in soft soldering aluminium and its alloys and a soft solder alloy of lead, tin and silver and, optionally, up to 3% copper.
Claims12
A fluxed solder composition for use in soft soldering aluminium or aluminium alloys, said composition comprising in association (a) a soft solder alloy having a melting point of less than 300.degree. C, said alloy consisting essentially of at least 35% by weight of lead, not less than 10% by weight of tin, from 0 to 3% by weight of copper, and silver with the relative amounts of silver and tin in said alloy being such that said amounts of silver and tin are within the area above the curve AA' in FIG. 2 of the drawings, and (b) a flux suitable for use in aluminium soldering selected from organic fluxes and reaction fluxes.
Dependencies are inferred from the claim text.