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US 4,069,498 AGranted
Studded heat exchanger for integrated circuit package
AssigneeInternational Business Machines Corporation
InventorKailash Chandra Joshi
Life of this patent
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AssigneeInternational Business Machines Corporation
InventorKailash Chandra Joshi
Estimating the term…
Heat is removed from the silicon devices in an integrated circuit package by means of a stud which is slidably mounted in a cap enclosing the integrated circuit device. A low melt solder is used to join the stud to the cap and the same solder is also deposited on the stud tip, which will subsequently contact the integrated circuit device in the package. After the integrated circuit, substrate and cap are assembled and sealed, the assembly is heated to melt the low melt solder so that the stud slides down and makes contact with the integrated circuit device. A controlled pressure can be applied to the stud if sliding does not occur. Thereafter, the assembly is allowed to cool. Upon cooling, a submicron gap exists between the solder on the tip of the stud and the device providing electrical isolation, but not significantly degrading the thermal path between the device and the ambient atmosphere.
In and integrated circuit assembly including at least one integrated circuit device suitably mounted on a circuitized substrate with a cap covering the device on the substrate, the improvement comprising:
In an integrated circuit assembly including a plurality of integrated circuit devices suitably mounted on the top side of a circuitized silicon substrate, a heat transfer mechanism adapted to remove heat from said silicon substrate, comprising:
In an encapsulated assembly including a large silicon substrate which is adapted to generate heat, a heat transfer mechanism adapted to remove heat from said silicon substrate, comprising:
Dependencies are inferred from the claim text.