High heat dissipation mounting for solid state devices and circuits

An electronic assembly for enabling enhanced dissipation of heat from a heat generating portion of a solid state device, said assembly comprising said solid state device;

• a heat dissipation plate supplied externally to said solid state device;
• and means for mechanically clamping said solid state device to said externally supplied heat dissipation plate;
• said solid state device comprising an electrically insulating thermally conductive substrate and a current carrying film layer disposed directly on one surface of said substrate without the interposition of any thermal barrier therebetween, said current carrying film layer generating heat as a result of current flow therein;
• said mechanical clamping means mechanically clamping said solid state device to said externally supplied heat dissipation plate in direct thermally conductive bearing relationship between the thermally conductive substrate surface which is opposite to said one surface and said externally supplied heat dissipation plate for providing a direct thermally conductive heat dissipation path for heat generated in said current carrying layer to said thermally conductive substrate and therethrough to said externally supplied heat dissipation plate for thermal dissipation of said generated heat throughout said heat dissipation plate surface area.