Low-pressure, no-cool phenolic type resin for decorative laminates
AssigneeGeorgia-Pacific Corporation
InventorLeopold F. Bornstein
Life of this patent
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Abstract
Phenolic resins employed in the manufacture of high-pressure decorative laminates are modified by the addition of a partially etherified melamine-formaldehyde resin which is the reaction product of melamine, formaldehyde, an aliphatic polyol and furfural. The modified phenolic resin exhibits better penetration and flow properties and cures more rapidly. Laminates made with this modified resin can be manufactured at lower pressures and without the lengthy in-press cooling step of the prior art. Moreover, the laminates so produced possess enhanced flexibility due to the internal plasticizing effect of the modifier of the present invention.
Claims5
A laminating resin composition comprising a thermosetting phenolic resin modified with about 5 to about 10 percent by weight of the resin solids of a partially etherified melamine-formaldehyde resin, said partially etherified melamine-formaldehyde resin comprising the reaction product of from about 10 to 25 percent by weight of melamine, from about 5 to 12 percent by weight of formaldehyde on a dry basis, from about 20 to 40 percent of an aliphatic polyol and from about 10 to 30 percent by weight of furfural.
Dependencies are inferred from the claim text.