Apparatus for automatic, continuous selective plating on a tape member
OwnerHiroko Abeiinventor
Life of this patent
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Abstract
The present invention relates to an apparatus to effect a selective plating automatically and continuously in order to make connecting elements such as connectors or contact elements such as relays. More particularly it relates to an apparatus to conduct a selective plating automatically and continuously at least on one of the upper and lower surfaces of a metal strip member unfolded from a roll, wherein the metal strip is moved intermittently in one direction correspondingly with the intervals at which at least one cleaning nozzle, one vacuum nozzle and one plating nozzle are linearly arranged while it is kept pressed onto the tips of the nozzles.
Claims9
An apparatus for automatic, continuous selective plating on desired portions of a metal strip, which comprises a plating section including at least one cleaning nozzle, one vacuum nozzle and one plating nozzle, each of said nozzles being mounted in said plating section, which have a shape corresponding to the desired plating layers to be formed and which are arranged linearly, a feeding mechanism for feeding said metal strip on said nozzles intermittently in one direction at a pitch equal to the intervals at which said nozzles are arranged so as to locate said desired portions adjacent said nozzles, a pressing mechanism for pressing only said desired portions of said metal strip onto said nozzles while the metal strip is stopped moving, and means for selectively supplying cleaning liquid to said cleaning nozzle, vacuum to said vacuum nozzle and plating liquid to said plating nozzle.
Dependencies are inferred from the claim text.